Turnkey ASIC Development Services

Design&Engineering services are tailored to provide one-stop turnkey ASIC solutions.

Development flow activities herein are structured into design related services at the front-end as well as manufacturing and test related services at the back-end. Needless to say that any service is also individually available to our customers.

Design&Engineering services start at an early stage of the product development when there is just a product idea as a base for the ASIC Definition.

As an independent service provider Micram selects the best and most economical technology for the ASIC by a specific Technology Evaluation. Based on the chosen technology and the ASIC Definition, a Feasibility Study leads to a detailed specification not just for the ASIC but for the entire development (e.g. test, package, qualification…). In order to gain high speed and performance, even sophisticated state-of-the-art design flows need to be improved by application specific Design Tools introduced in the ASIC Design. In parallel, Package Design and Test Development are started to ensure the requirements of tough time schedules and matching design objectives.

For the backend services, already during design and after tape out Micram takes care about the Technology Run at the foundry and covers all verification and yield issues once the ASIC comes out of the fab. In the back-end processing Micram Design&Engineering participates in Wafer Test as well as in Assembly and Module Test.

In addition, all Design&Engineering activities are enhanced by Rapid!Prototyping, Test&Measurement as well as Supply Chain Management services.

What we cover

ASIC Definition

The primary focus of Micram’s Test&Measurement laboratory is on high speed / high frequency measurements of digital and analog integrated circuits (ICs) and systems as well as of passive components and interconnects.

Micram’s measurement capabilities range from DC to

  • 50 GHz in time domain (Sampling scope, frequency synthesis, modulation)
  • 50 Gb/s for pattern generation (soon to be extended to 100 Gb/s)
  • 50 Gb/s for BER testing (soon to be extended to 100 Gb/s)
  • 65 GHz for S-parameter measurements (soon to be extended to 110 GHz)
  • 100 GHz for spectrum analysis

All measurements can be carried out for single ended as well differential devices. Moreover, measurements of even-, odd- and conversion-modes in time and frequency domain are supported. For automatization, the measurement equipment can be remote controlled. Various computer programs for automatic data acquisition and processing as well as for instrument control are available.

Technology Evaluation

Conventional functional test on wafer level is used for preselection of good dies. This kind of test, usually applied in production at high volumes is provided by Micram via industrial partner services.

Wafer level services at Micram focus on the time critical engineering phase of wafer and die, which requires highest flexibility in measurement setup.  During that period, measurement and test (probing) on wafer or bare die level is a fast and straightforward way to interact with the chip. All pads are directly accessible and probing configurations can be changed on the fly depending on the actual needs. Besides pure functional verification, especially at-speed measurements (currently up to 65 GHz) are a valuable aid for verification, characterization or deembedding of the plain chip performance.  As a benefit, time and cost for the assembly process can be saved or spent after successful wafer/die level measurements.

For advanced root cause of error analysis, even probing on metallization and lines of the chip wiring is possible by special measures. For modifications, ultrasonic cutting of the chip wiring can be performed even in conjunction with the ongoing measurements. Complementary laser and FIB options are accessible via industrial partner services.

Feasibility Study

In order to verify proper device operation and to measure/characterize performance under application conditions, a method must exist to interface the measurement equipment to the device under test.

Depending on the application, there is a wide variety of requirements for this interface.

Some examples are:

  • Support of large number of signals.
  • High frequency and/or wide bandwidth.
  • High current densities (e.g. well defined and low supply voltage drop).
  • DC decoupling.
  • RF signal blocking.
  • Well known modeled properties, which can be considered in resimulations.
  • Deembedding/calibration capability.
  • Quick adoption/optimization capability according to measurement results.
  • Thermal interface with adequate, defined properties.
  • Probing capability (wafer prober) for RF and DC signals.
  • Standard or modularized fixtures, e.g. for recurring measurements.

Interfacing and fixturing for Test&Measurement are provided by -Micram Rapid!Prototyping services. For a detailed description and examples of this comprehensive service, please refer to the related Rapid!Prototyping section or contact your Micram sales representative.

Design Tools and Modeling

High performance design needs high performance models.

Adequate, application specific modeling considers all parasitics and effects on the chip as well as of the assembly with external components and the board with load which are suspect to degrade the intended device performance.

Likewise high performance designs, any design with special or unique properties suffers from the lack of appropriate models at design time since modeling often relates to the specialties of the design. Therefore, a fast method for model derivation and validation as well as model parameter extraction must exist in order to support the design promptly on demand.

As a major benefit of Micram’s whole service provider concept, all modeling tasks are in-house services without delaying interfaces in between and can be performed simultaneously to the requirements of the related ASIC design:

Model development is a Design Tool service located in and interacting with the requirements of Design&Engineering.

Test structures, fixtures and interfaces for measurements are designed and produced as a Rapid!Prototyping service (cf. Interfacing page).

Model parameter extraction, model validation as well as investigations on effects supposed to be modeled, is performed under Test&Measurement activities. Modeling service is offered in conjunction with any Micram turnkey ASIC development as well as a separate complementary customer service.